Drive growth and diversification of advanced microelectronics and Multi-Chip Module (MCM) manufacturing business, focusing on aerospace, medical, defense, and high-reliability electronics industries.
Responsibilities
Develop new business within aerospace, medical, defense, and other high-reliability electronics markets.
Identify and pursue prospective customers and manufacturing programs that align with MCM, SCM, microelectronics, and electronics assembly capabilities.
Establish relationships with engineering, supply chain, procurement, program management, and other key customer decision makers.
Develop and maintain a qualified pipeline of new business opportunities.
Serve as the technical and commercial interface between customers and internal engineering, manufacturing, quality, and operations teams.
Requirements
Bachelor’s degree in Engineering, Electronics, Manufacturing Engineering, Materials Science, Physics, or a related technical discipline
Nice to have: 10+ years of relevant industry experience
Lead the development and execution of corporate-level strategies for high-speed signaling technologies across advanced semiconductor packaging, sockets, and connectors.
Compensation
Your base salary will be determined based on your location, experience, and other objective job-related factors. The expected base salary range for this position is 320,000 USD – 488,750 USD.
Responsibilities
Lead the development and execution of corporate-level strategies for high-speed signaling technologies across advanced semiconductor packaging, sockets, and connectors.
Oversee technical direction and implementation for next-gen products ranging from ultra-mobile to high-performance AI and HPC platforms.
Architect and deliver state-of-the-art interconnect and packaging solutions for standards such as UCIe, HBM, DDR, PCIe, and industry-leading SerDes (224G/448G).
Enable advanced packaging technology solutions for co-packaged optics, stacked die, chiplet-based architectures and IVR solutions.
Development of modeling and characterization flows, flow automations, design for high volume manufacturing techniques.
Work closely with sales, field application, engineering, operations, and key customers to identify system‑level pain points and translate them into differentiated integration opportunities and product concepts
Develop product roadmaps and portfolio plans for multi‑die package products; define product positioning, target markets, application scenarios, competitive value propositions, and business priorities
Lead system‑level product definition across MCU, gate‑driver, power‑device, power‑management, and memory functions, balancing electrical performance, thermal performance, reliability, package size, cost, manufacturability, and supply continuity
Requirements
Bachelor’s degree in Electronic Engineering, Microelectronics, Semiconductor Engineering, Materials Science, Automation, or a related discipline
Define and develop semiconductor packages from concept to realization, driving package design, technology, cost and innovation for new products.
Responsibilities
Drive technical definition for package projects with major changes or new packages, including BOM, package design, assembly technology, PRP review and project classification.
Generate conceptual package outlines and internal construction drawings, finalize and document drawings, and update package drawings as needed.
Define package characteristics to meet electrical, thermal, reliability and mechanical requirements.
Coordinate Package Cost Estimation and Cost Indication.
Act as the contact partner for package definition, particularly on Back-End assembly technology know-how.
Owns assembly and test yield for an advanced packaging platform from NPI through high-volume manufacturing, working across OSAT and foundry partners, Product Engineering, and Package Design.
Responsibilities
Own packaging yield for a portfolio of advanced packaging products from NPI through ramp to high-volume manufacturing.
Lead technical engagement with OSAT and foundry partners: set yield targets, run joint yield reviews and drive corrective actions to owner and committed date.
Drive root cause analysis on yield issues (detection, bin analysis, inline and equipment data, failure analysis) against a ≤1-day time to first actionable insight.
Build and maintain root cause Paretos for each product and drive the top contributors to closure with partners.
Publish a weekly yield report and lead yield reviews with Business Unit, Product Engineering and partner leadership.
Lead all aspects of the full lifecycle of APTD programs, including planning, execution, monitoring, and closure, and manage cross‑functional teams across APTD, PDE, CPI, and NPI to ensure timely, high‑quality delivery of critical initiatives.
Responsibilities
Lead all aspects of the full lifecycle of APTD programs
Define program objectives, deliverables, resource plans, and success metrics
Lead cross‑functional teams across APTD, PDE, CPI, and NPI
Develop and implement standardized PMO methodologies, tools, and templates
Lead CapEx and OpEx planning, PTM and MOR processes, and integrate BOP design systems
Requirements
Bachelor’s or Master’s degree in Engineering, Materials Science, or related technical field
Senior NPI Engineer responsible for the full lifecycle of APTD programs, including planning, execution, and cross-functional leadership to ensure high-quality delivery delivery.
Responsibilities
Lead all aspects of the full lifecycle of APTD programs, including planning, execution, monitoring, and closure.
Define program objectives, deliverables, resource plans, and success metrics.
Lead cross-functional teams across APTD, PDE, CPI, and NPI to ensure timely, high-quality delivery of critical initiatives.
Develop and implement standardized PMO methodologies, tools, and templates.
Lead CapEx and OpEx planning, PTM and MOR processes, and integrate BOP design systems.
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