Support the development, modification, and optimization of manufacturing processes to improve efficiency, quality, yield, throughput, and process stability.
Compensation
Competitive salary and annual bonus program. Equity compensation eligibility.
Responsibilities
Support the development, modification, and optimization of manufacturing processes to improve efficiency, quality, yield, throughput, and process stability.
Monitor and analyze manufacturing process performance using production data, test results, and statistical process control (SPC) to identify trends and opportunities for improvement.
Investigate and troubleshoot manufacturing process issues, identify root causes, and implement corrective actions to prevent recurrence.
Maintain process control plans, specifications, and operating parameters to ensure consistent manufacturing performance and compliance with established requirements.
Conduct process testing, characterization, and validation activities to evaluate process capability and establish appropriate operating limits.
Requirements
Bachelor's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, Materials Science, Physics, or a related technical field, or equivalent work experience.
Nice to have: familiarity working in a manufacturing or cleanroom environment
As a Yield Enhancement Engineer, you will drive strategic yield improvement initiatives across Micron's advanced memory portfolio, including DRAM, NAND, and HBM technologies. You will collaborate globally to optimize manufacturing performance, accelerate business outcomes, and advance engineering excellence through data-driven methodologies and AI-enabled solutions.
Responsibilities
Lead strategic yield improvement programs across DRAM, NAND, and HBM technologies by converting complex manufacturing and product challenges into scalable, actionable solutions.
Drive cross-fab yield benchmarking, performance analysis, and predictive modeling to identify improvement opportunities, establish performance targets, and accelerate yield optimization across global manufacturing sites.
Define, deploy, and sustain Yield Improvement (YE) Best Known Methods (BKMs) globally, enabling standardization, information exchange, and engineering excellence throughout Micron's manufacturing network.
Champion the digital transformation of Yield Management Systems (YMS) and Yield Enhancement workflows through automation, artificial intelligence, machine learning, and advanced analytics in partnership with Fab, SMAI, and multi-functional stakeholders.
Provide technical leadership and influence across Yield Enhancement (YE), Process Integration Engineering (PIE), Process Engineering (PE), Global Quality (GQ), Technology Development (TD), and Manufacturing teams to drive alignment and execution of strategic yield objectives.
We are seeking a talented and driven Machine Vision Software Engineer to design, develop, and deploy cutting‑edge automated inspection and metrology systems for our advanced semiconductor manufacturing equipment.
Compensation
Base Salary Range: $115,200.00 - $172,800.00, offered in good faith and based on experience, location, and qualifications.
Responsibilities
Design, optimize, and implement robust machine vision algorithms using MVTec HALCON and C++ for semiconductor defect detection, alignment, metrology, and 2D/3D inspection.
Write clean, maintainable, and high‑performance C++ code in a multi‑threaded, multi‑process real‑time Windows or Linux environment.
Interface software with industrial cameras (GigE), frame grabbers, optics, and specialized lighting systems.
Develop and calibrate high‑precision coordinate transformation matrices (pixel‑to‑world) to ensure micron‑level spatial accuracy.
Partner with mechanical, electrical, and automation engineers to test, debug, and validate vision systems on actual manufacturing tools.
Requirements
Bachelor’s degree in Computer Science, Electrical Engineering, Mechatronics, or a related technical field
Nice to have: OpenCV
Nice to have: SECS/GEM communication protocols
Nice to have: deep learning extensions within HALCON
Technical leader in the ASIC design team responsible for innovation, leading complex projects, and mentoring engineers while mapping customer designs into Honeywell Aerospace platforms.
Locations (3)
Plymouth, Minnesota, United States
Clearwater, Florida, United States
Moca, Puerto Rico, Puerto Rico
Compensation
The annual base salary range for this position is $173,000-$200,000. This position is incentive eligible.
Responsibilities
Lead the implementation of customer ASIC designs into Honeywell Aerospace ASIC platforms and technologies
Lead customer-facing technical interactions and bridge between design/fabrication services and customer needs
Collaborate with cross-functional teams including physical design, IC packaging, layout verification, test, reliability, and program management
Lead the global Integrated Circuit commodity strategy, driving standardization, risk mitigation, and supplier qualification across Siemens locations worldwide.
Responsibilities
Define and drive the implementation and continuous evolution of the global Integrated Circuit commodity strategy
Identify emerging technologies, industry trends, and supplier capabilities and translate them into a technology roadmap
Collaborate closely with R&D, Procurement, Engineering and Supply Chain to translate technical requirements into supplier specifications
Lead and coordinate the global Commodity Engineering network for ICs and ensure effective collaboration across locations
Drive standardization, risk mitigation, second‑source strategies and cost optimization
Requirements
Bachelor's degree in Electrical Engineering, Electronics, or a comparable technical discipline
Ensuring quality and reliability performance of products through best in class Product Qualification in accordance with international standards and customer requirements.
Responsibilities
Attend related Milestones Meetings
Define, perform, and review Qualification (new products, second source, material changes, design changes, process changes)
Define, evaluate, and implement suitable stress tests for related product applications
Ensure product compliance with internal specifications, customer requirements, and applicable standards (e.g., ISO 9001, IATF 16949, IEC, JEDEC, etc.)
Communicate qualification plans and data with customer (Silicon, Package and Board Level)
Lead complex ASIC/SoC development programs from concept through silicon production and product release.
Responsibilities
Lead end-to-end ASIC/SoC development programs
Develop, maintain, and manage integrated program plans, schedules, milestones, dependencies, and critical paths
Coordinate closely with architecture, digital design, analog design, verification, physical design, DFT, CAD, product engineering, packaging, foundry, and operations teams
Drive program reviews, monitor progress, identify risks, and implement mitigation plans
Establish clear ownership, accountability, governance, and escalation processes
Requirements
Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or a related technical discipline
Nice to have: Master's degree in Engineering, Computer Science, or Business Administration
Nice to have: PMP certification
Nice to have: advanced technology nodes (3nm, 2nm, and beyond)
Manufacturing Process Engineer IINewPHOTRONICS INC · Brookfield, US
SR/STAFF ENGINEER, FECOS CPIE YENewMicron Technology · Boise, US
Technical Project Manager 3Nokia Global Career Site · India