Develop and apply ray-tracing, wave-optics, and analytical models to design and optimize fiber-optic connectors and waveguides. Use simulation results to explain the underlying physical mechanisms and support prototype development.
Responsibilities
Design, model, and analyze fiber-optic connectors and fiber-to-chip interfaces.
Calculate and analyze optical modes in fibers and waveguides, and model light propagation and coupling between fibers, waveguides, and photonic chips.
Perform sensitivity, tolerance, and Monte Carlo analyses to predict coupling efficiency, insertion loss, and performance statistics.
Optimize designs for optical performance and turn simulation results into design rules and specifications that support prototype fabrication.
Compare simulation results with measurement data and support root-cause analysis of discrepancies and performance issues.
Requirements
Ph.D or Master's degree in Physics, Applied Physics, Optics, Photonics, Optical Engineering, or a related technical field
Nice to have: telecommunications
Nice to have: optical connectivity
Nice to have: co-packaged optics
Nice to have: data center and AI interconnect architectures
Entry-level role focused on mechanical product design and analysis for satellite missions, involving cradle-to-grave work from design to production including thermal/structural/vibration analysis.
Compensation
Summary pay range: $79,050 - $106,950
Responsibilities
Coordinate with multi-discipline groups to develop and understand requirements and develop high-level and detailed designs consistent with those requirements
Guides structural design and configuration development by performing trade studies to optimize structure and meet program requirements
Performs detailed structural and thermal analysis using hand calculations and analysis tools
Documents structural analyses and data required to show compliance with Boeing, customer and regulatory requirements, at a module, slice, and unit level
Collaborate with Electrical Engineering team to perform sizing and placement studies, as well as layout and route printed circuit boards (PCBs)
Requirements
Bachelor of Science degree in Engineering (Electrical, Mechanical or Aeronautical)
Lead the RF and power electronics design for Synchron's next-generation implantable electronics, overseeing wireless telemetry, antenna, inductive power, and battery systems.
Compensation
$160k - $200k/year
Responsibilities
Define implant wireless architecture and select transceiver ICs
Derive and maintain link budgets and design RF front ends
Design and integrate implant and external antennas
Lead regulatory and wireless coexistence testing
Design inductive power link and power management
Requirements
BS in electrical engineering or related discipline
Seeking a CFD and Multiphysics Modeling Engineer to develop and apply computational fluid dynamics, heat-transfer, mass-transfer, and related multiphysics models across Qnity's businesses to address complex engineering challenges.
Responsibilities
Serve as a central technical resource for application and product-development programs involving CFD, fluid flow, heat and mass transfer, and related multiphysics phenomena.
Work with scientists, engineers, and business teams to translate application, product, and process challenges into clear modeling objectives.
Determine what should be modeled and select an appropriate scope, assumptions, dimensionality, and level of fidelity based on the governing physics, available information, business objectives, and timelines.
Recognize when modeling can meaningfully support a program and identify when additional data, experiments, or other technical approaches are needed.
Model coupled phenomena such as fluid flow, heat and mass transfer, particle transport, electrochemistry, and mechanics as appropriate to the problem.
Coordinate with multi-discipline groups to develop and understand requirements and develop high-level and detailed designs consistent with those requirements
Guides structural design and configuration development by performing trade studies to optimize structure and meet program requirements
Performs detailed structural and thermal analysis using hand calculations and analysis tools
Documents structural analyses and data, required to show compliance with Boeing, customer and regulatory requirements, at a module, slice, and unit level
Collaborate with Electrical Engineering team to perform sizing and placement studies, as well as layout and route printed circuit boards (PCBs)
Requirements
Bachelor of Science in Engineering
Bachelor's Degree or Equivalent
Nice to have: Active U.S. Top Secret/SCI Security Clearance
Nice to have: Experience within aerospace or related industry or with space electronics
Nice to have: Experience leading teams on complex projects
Lead coordination of multi-discipline groups to develop and understand requirements and develop high-level and detailed designs consistent with those requirements
Compensation
Summary pay range: $146,200 - $197,800
Responsibilities
Lead coordination of multi-discipline groups to develop and understand requirements and develop high-level and detailed designs consistent with those requirements
Guide structural design and configuration development by performing trade studies to optimize structure and meet program requirements
Performs detailed structural and thermal analysis using hand calculations and analysis tools
Documents structural analyses and data, required to show compliance with Boeing, customer and regulatory requirements, at a module, slice, and unit level
Collaborate with Electrical Engineering team to perform sizing and placement studies, as well as layout and route printed circuit boards (PCBs)
Requirements
Bachelor of Science degree in Engineering (with a focus in Electrical, Mechanical or Aeronautical), Computer Science, Data Science, Mathematics, Physics, Chemistry or non-US equivalent qualifications directly related to the work statement
Nice to have: Active U.S. Top Secret/SCI Security Clearance
Nice to have: Experience within aerospace or related industry or with space electronics
Nice to have: 3+ years of experience leading teams on complex projects
Space Electronics Packaging and Mechanical Product Design and Analysis Engineer
Design, analyze, and support space electronics packaging and mechanical products, including structural, thermal, and vibration analysis, PCB layout, and integration with satellite systems.
Compensation
Summary Pay Range (Associate - Level 2): $98,600- $133,400
Summary Pay Range (Mid-Level - Level 3): $119,850- $162,150
Responsibilities
Coordinate with multi-discipline groups to develop and understand requirements and develop high-level and detailed designs consistent with those requirements
Guides structural design and configuration development by performing trade studies to optimize structure and meet program requirements
Performs detailed structural and thermal analysis using hand calculations and analysis tools
Documents structural analyses and data, required to show compliance with Boeing, customer and regulatory requirements, at a module, slice, and unit level
Collaborate with Electrical Engineering team to perform sizing and placement studies, as well as layout and route printed circuit boards (PCBs)
Requirements
Bachelor of Science degree in Engineering (with a focus in Electrical, Mechanical or Aeronautical), Computer Science, Data Science, Mathematics, Physics, Chemistry or non-US equivalent qualifications directly related to the work statement
Nice to have: Mid-Level (Level 3): 5+ years of related work experience or an equivalent combination of technical education and experience
Space Electronics Packaging and Mechanical Product Design and Analysis Engineer (Associate)
Design and analyze space electronics packaging and mechanical products, performing structural, thermal, and vibration analysis, and collaborating with cross‑disciplinary teams.
Compensation
Summary Pay Range: $98,600- $133,400
Responsibilities
Coordinate with multi‑discipline groups to develop and understand requirements and develop high‑level and detailed designs consistent with those requirements
Guide structural design and configuration development by performing trade studies to optimize structure and meet program requirements
Perform detailed structural and thermal analysis using hand calculations and analysis tools
Document structural analyses and data to show compliance with Boeing, customer and regulatory requirements
Collaborate with Electrical Engineering team to perform sizing and placement studies and layout and route printed circuit boards (PCBs)
Requirements
Bachelor of Science degree in Engineering (with a focus in Electrical, Mechanical or Aeronautical), Computer Science, Data Science, Mathematics, Physics, Chemistry or non-US equivalent qualifications directly related to the work statement
Nice to have: Active U.S. Top Secret/SCI Security Clearance
Nice to have: Experience within aerospace or related industry or with space electronics
Nice to have: Experience leading teams on complex projects
Space Electronics Packaging and Mechanical Product Design and Analysis Engineer (Subject Matter Expert)
Lead coordination of multi-discipline groups to develop and understand requirements and develop high-level and detailed designs consistent with those requirements
Compensation
Summary pay range: $146,200 - $197,800
Responsibilities
Lead coordination of multi-discipline groups to develop and understand requirements and develop high-level and detailed designs consistent with those requirements
Guide structural design and configuration development by performing trade studies to optimize structure and meet program requirements
Performs detailed structural and thermal analysis using hand calculations and analysis tools
Documents structural analyses and data, required to show compliance with Boeing, customer and regulatory requirements, at a module, slice, and unit level
Collaborate with Electrical Engineering team to perform sizing and placement studies, as well as layout and route printed circuit boards (PCBs)
Requirements
Bachelor of Science degree in Engineering (with a focus in Electrical, Mechanical or Aeronautical), Computer Science, Data Science, Mathematics, Physics, Chemistry or non-US equivalent qualifications directly related to the work statement
Nice to have: Active U.S. Top Secret/SCI Security Clearance
Nice to have: Experience within aerospace or related industry or with space electronics
Nice to have: Experience with ANSYS analysis, Creo CAD, SolidWorks, Finite Element Analysis (FEA), Siemens NX Nastran, MSC Patran, COMSOL Multiphysics
Senior Optical ScientistNewCorning · Helsinki, Finland
Principal R&D Engineer, RF & Implant PowerSynchron Inc. · San Diego, US
CFD and Multiphysics Modeling EngineerQnity · Wilmington, US
Space Electronics Packaging and Mechanical Product Design and Analysis Engineer (Associate)Boeing · El Segundo, US