Design, develop, and optimize RF hardware and PCB layouts for wireless communication products, including WiFi and Bluetooth, ensuring high performance, cost efficiency, and quality.
Responsibilities
Design, develop, and optimize RF hardware, including PCB and package layouts, for wireless applications such as WiFi and Bluetooth.
Define floorplans, layouts, and physical designs for RF circuit architecture while adhering to design rules and manufacturing constraints.
Collaborate with cross-disciplinary teams to integrate silicon, package, and board-level designs as part of a co-design optimization process.
Take ownership of PCB layout from component placement to final output, supporting manufacturing and assembly processes.
Implement design rules specific to substrate/PCB technologies and ensure compliance with DRC and DFM requirements.
Requirements
Bachelor's or BS degree in Electrical Engineering, Mechanical Engineering, or a related field
Nice to have: RF physical design for wireless products
Nice to have: Si-Package-Board co-design optimization
Research, design, develop, and/or test electronic components and systems for semiconductor and related device manufacturing, employing knowledge of electronic theory.
Responsibilities
Verify mask designs against a host of leading edge physical and electrical checks and guidelines.
Oversee mask designs for various complex macros and tiles to integrated at the SOC level.
Utilize understanding of DRC/LVS debug, EM/IR and density concerns and contribute to all areas of design flow.
Drive projects or processes of significant technical importance.
Exercise independent judgment to select methods, techniques and evaluation criteria for obtaining results.
Lead and support high voltage core systems engineering projects, design specifications, and global implementation of technical assessment processes.
Compensation
This position is a salary grade 5 to salary grade 8. Salary grade ranges from $65,100-$109,300; salary grade 6 ranges from $74,300-$124,500; salary grade 7 ranges from $86,600-$144,900; salary grade 8 and ranges from $99,100-$166,200.
Responsibilities
Act as project lead for high voltage electrical system projects and studies
Lead the development of a core generic high voltage system design specification document
Lead cross functional interfaces within EPE
Develop traceability between xEV attributes and requirements
Lead global implementation of the Technical Assessment Process
Requirements
Bachelor's degree in Engineering, Electrical, Systems, or equivalent Engineering discipline
Nice to have: M.S. in Electrical, Systems, or equivalent Engineering discipline
Nice to have: vehicle program experience – PAT, PMT or D&R
Lead and support high voltage core systems engineering projects, design, documentation, and process implementation.
Compensation
This position is a salary grade 5 to salary grade 8. Salary grade ranges from $65,100-$109,300; salary grade 6 ranges from $74,300-$124,500; salary grade 7 ranges from $86,600-$144,900; salary grade 8 and ranges from $99,100-$166,200.
Responsibilities
Act as project lead for high voltage electrical system projects and studies
Lead the development of a core generic high voltage system design specification document
Lead cross functional interfaces within EPE
Develop traceability between xEV attributes and requirements
Lead global implementation of the Technical Assessment Process
Requirements
Bachelor's degree in Engineering, Electrical, Systems, or equivalent Engineering discipline
M.S. in Electrical, Systems, or equivalent Engineering discipline
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