Provide technical support, installation, testing, and troubleshooting for tactical communications systems in support of USG in the Herndon area.
Locations (2)
Sterling, Virginia, United States
Herndon, Virginia, United States
Compensation
The salary associated with this position ($99,000-$206,000) is commensurate with the selected candidate’s qualifications, years of relevant experience, and demonstrated level of expertise.
Responsibilities
Support system build, deployment and installation efforts
Provide testing, analysis, and troubleshooting/lifecycle support for hardware/software/network systems
Track progress of assigned installations and upgrades
Conduct site surveys and prepare system documentation
Provide technical leadership for the delivery and activation of network connectivity supporting OCI regions, AI infrastructure, capacity expansion, and strategic network deployments.
Compensation
US: Hiring Range in USD from: $91,400 to $187,000 per annum. May be eligible for bonus and equity.
Responsibilities
Provide technical leadership for the delivery and activation of network connectivity supporting OCI regions, AI infrastructure, capacity expansion, and strategic network deployments.
Translate network designs and engineering requirements into technical requirements for carriers, fiber providers, ISPs, colocation providers, and other infrastructure partners.
Support the delivery of carrier circuits, dark fiber, lit fiber, wavelengths, optical transport, Internet transit, peering, backbone connectivity, cross-connects, and data center interconnects.
Review connectivity requirements, designs, demarcation points, handoffs, physical paths, optics, interfaces, capacity, and technical dependencies before implementation.
Validate delivered infrastructure against OCI engineering requirements before operational handoff.
Lead product strategy and roadmap for next-generation data center switching platforms with a focus on AI networking and high-performance Ethernet fabrics.
Compensation
The expected salary/wage range for this position is provided below. Actual offer may vary from this range based upon geographic location, work experience, education/training, and/or skill level. – United States of America: Annual Salary USD 187,000 - 377,500 in California
Responsibilities
Independently lead and drive the end-to-end product strategy and operational product roadmap for many complex products or product portfolios.
Shape the multi-generation architecture and product direction for data center switching, including AI scale-up, scale-out, front-end, and data center interconnect networks.
Define platform requirements across bandwidth, radix, topology, latency, congestion management, power, cooling, optics, cabling, form factor, and rack integration.
Evaluate emerging technologies including switching silicon and SerDes, high-speed electrical interconnects, OSFP, LPO, LRO, XPO, NPO, CPO, silicon photonics, liquid cooling, power delivery, and rack-scale architectures.
Lead fact-based trade-off analyses across customer value, performance, power, density, reliability, serviceability, manufacturability, cost, ecosystem readiness, supply availability, and time to market.
Requirements
Bachelor's degree in computer science, engineering, or related field
MBA or advanced degree in computer science or engineering (preferred)
Senior Principal, Product Manager - Data Center and AI Networking Hardware Architecture
Lead product strategy and roadmap for next‑generation data center switching platforms with a focus on AI networking and high‑performance Ethernet fabrics.
Compensation
The expected salary/wage range for this position is provided below. Actual offer may vary from this range based upon geographic location, work experience, education/training, and/or skill level. – United States of America: Annual Salary USD 187,000 - 377,500 in California
Responsibilities
Independently lead and drive the end‑to‑end product strategy and operational product roadmap for many complex products or product portfolios.
Shape the multi‑generation architecture and product direction for data center switching, including AI scale‑up, scale‑out, front‑end, and data center interconnect networks.
Define platform requirements across bandwidth, radix, topology, latency, congestion management, power, cooling, optics, cabling, form factor, and rack integration.
Evaluate emerging technologies including switching silicon and SerDes, high‑speed electrical interconnects, OSFP, LPO, LRO, XPO, NPO, CPO, silicon photonics, liquid cooling, power delivery, and rack‑scale architectures.
Lead fact‑based trade‑off analyses across customer value, performance, power, density, reliability, serviceability, manufacturability, cost, ecosystem readiness, supply availability, and time to market.
Requirements
Bachelor's degree in computer science, engineering, or related field of study
MBA or advanced degree in computer science or engineering (preferred)
Senior Principal, Product Manager - Data Center and AI Networking Hardware Architecture
Lead product strategy and roadmap for next-generation data center switching platforms with a focus on AI networking and high-performance Ethernet fabrics.
Compensation
The expected salary/wage range for this position is provided below. Actual offer may vary from this range based upon geographic location, work experience, education/training, and/or skill level. – United States of America: Annual Salary USD 187,000 - 377,500 in California
Responsibilities
Independently lead and drive the end-to-end product strategy and operational product roadmap for many complex products or product portfolios.
Shape the multi-generation architecture and product direction for data center switching, including AI scale-up, scale-out, front-end, and data center interconnect networks.
Define platform requirements across bandwidth, radix, topology, latency, congestion management, power, cooling, optics, cabling, form factor, and rack integration.
Evaluate emerging technologies including switching silicon and SerDes, high-speed electrical interconnects, OSFP, LPO, LRO, XPO, NPO, CPO, silicon photonics, liquid cooling, power delivery, and rack-scale architectures.
Lead fact-based trade-off analyses across customer value, performance, power, density, reliability, serviceability, manufacturability, cost, ecosystem readiness, supply availability, and time to market.
Requirements
Bachelor's degree in computer science, engineering, or related field of study
MBA or advanced degree in computer science or engineering preferred
Senior Principal, Product Manager - Data Center and AI Networking Hardware Architecture
Lead product strategy and roadmap for next-generation data center switching platforms with focus on AI networking.
Compensation
The expected salary/wage range for this position is provided below. Actual offer may vary from this range based upon geographic location, work experience, education/training, and/or skill level. – United States of America: Annual Salary USD 187,000 - 377,500 in California
Responsibilities
Independently lead and drive end-to-end product strategy and operational product roadmap
Shape multi-generation architecture and product direction for data center switching
Define platform requirements across bandwidth, radix, topology, latency, congestion management, power, cooling, optics, cabling, form factor, and rack integration
Evaluate emerging technologies including switching silicon and SerDes, high-speed electrical interconnects, OSFP, LPO, LRO, XPO, NPO, CPO, silicon photonics, liquid cooling, power delivery, and rack-scale architectures
Lead fact-based trade-off analyses across customer value, performance, power, density, reliability, serviceability, manufacturability, cost, ecosystem readiness, supply availability, and time to market
Requirements
Bachelor's degree in computer science, engineering, or related field; MBA or advanced degree preferred
Own the end-to-end network architecture for Runware's AI supercomputer, from scale‑up and scale‑out fabrics to storage, management, and inter‑site backbone, and lead the team building and operating the global network.
Locations (2)
United States
United Kingdom
Responsibilities
Own the end‑to‑end network architecture for the AI Factory
Design the optical layer and select transceivers, cables, and DWDM for pod‑to‑pod and metro links
Define the reference network design for the Sonic Inference Pod
Build and bring up the first fabrics, including rail‑optimized topologies, subnet management, routing, congestion control, QoS, and GPUDirect RDMA tuning
Run capacity planning and vendor roadmap with NVIDIA, switch and optics suppliers, and carriers
Serve as the primary operational program owner driving supplier execution, Statement of Work governance, and master build planning across silicon foundries, Tier-1/Tier-2 OSATs, and Contract Manufacturers.
Compensation
$149,000—$220,000 USD. total compensation goes beyond base salary, it also includes a new hire equity grant, annual performance-based equity, and other rewards
Responsibilities
Serve as the senior operational leader owning the complete material development lifecycle from NPI through HVM.
Act as the primary operations counterpart to engineering and quality teams, collaborating directly with external vendors to ensure all hardware materials are realized and available to support the master schedule.
Drive end-to-end operational execution for assigned electro-optical program lines by aligning customer and internal demand into master build plans.
Build and maintain virtual line-item Clear-To-Build (CTB) matrices across multi-tier suppliers.
Track component lead times and drive consigned material staging into OSAT and CM facilities to guarantee unblocked build execution.
Requirements
Bachelor's degree in Supply Chain, Business Management, or Engineering
Nice to have: Master’s degree in Supply Chain Management or Industrial Engineering
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