Package Development, Signal Integrity and Power Integrity Engineer, Principal
Marvell Technology · Posted Nov 10, 2026
- Westlake Village, California, United States
- Full-time · Principal
- $143K–$211K per year
- 5–8 years
High-speed IC package development engineer responsible for package development, electrical design, modeling, and characterization, including signal and power integrity aspects.
Compensation
Expected Base Pay Range (USD) 142,700 - 211,230, $ per annum
Responsibilities
- Develop advanced microelectronic packages for semiconductors supporting 448 Gb/s data rates and beyond
- Design electrical layouts and model package behavior
- Characterize packages using EM simulation tools
- Select package technology and drive layout with suppliers
- Ensure manufacturability and compliance with performance, reliability, and cost requirements
Requirements
- Bachelor’s degree in Computer Science, Electrical Engineering or related fields
- Master’s/PhD in Computer Science, Electrical Engineering or related fields
- Nice to have: Co-Packaged Optics
- Nice to have: 2.5D/3D package development
- Nice to have: thermal analysis