Engineer to design, develop and validate structural components for passenger trucks and vehicles.
Compensation
This position is a salary grade 6-8 and ranges from $74,300 - $166,200.
Responsibilities
Design and Release Engineering for Frame, Mounts, Spare Tire Winches, and/or Tow Hooks, responsible for forward model development, release, and through launch.
Apply engineering disciplines including DFMEA, PFMEA, Control Plans, Perfect Drawing Plan and Engineering Specifications.
Lead, review, and approve Frame Structure designs to ensure delivery to component ES and vehicle requirements.
Resolve all durability, assembly, and functional issues identified.
Coach, technical mentor, and guide peer engineers through Technical Club forums.
Requirements
Bachelor’s degree in mechanical engineering, Automotive Engineering, or a related engineering discipline
The Technical Specialist – Network Communications Hardware is a senior, hands‑on individual contributor responsible for the technical direction, electrical robustness, and production readiness of Ford’s in‑vehicle network hardware.
Compensation
This position is leadership level 6 and ranges from $132,800-$250,800. Final determination of salary grade will be based on candidate's skills and experience, and base salary will be set within the applicable range according to job scope, responsibility and competitive market value.
Responsibilities
Serve as Ford’s global technical authority for in‑vehicle networks hardware
Establish technical direction for CAN, LIN, Automotive Ethernet, SerDes, GMSL, FPD‑Link, and emerging communication technologies
Provide guidance on transceiver selection, circuit implementation, termination, protection components, grounding, PCB layout, connectors, cables, wiring topologies, and vehicle integration
Act as the technical escalation point for significant NetCom hardware decisions and issues
Author, own, interpret, and improve Ford NetCom hardware requirements, specifications, design rules, and validation methods
Requirements
Bachelor’s degree in electrical engineering or a related technical discipline
Nice to have: Master’s degree in Electrical Engineering or a related field
Nice to have: 15+ years of relevant automotive electronic‑hardware experience
Nice to have: expertise in network physical layers
Nice to have: knowledge of 10BASE‑T1S, 100/1000BASE‑T1, Multi‑Gigabit Ethernet
Principal Semiconductor Packaging Technologist – Customer Solutions
Lead packaging integration engineering for advanced semiconductor products, driving architecture decisions, customer engagement, and cross‑functional coordination.
Responsibilities
Drive packaging architecture decisions and IC‑PKG‑PCB co‑design for FPGA, embedded SoC, and custom ASIC programs spanning 2.5D/3D, OPC, and MOP technologies.
Lead DFM and DFMEA reviews and packaging supply qualification, partnering with OSAT/substrate suppliers on manufacturable, reliable, application‑ready solutions.
Serve as the primary customer‑facing contact for assigned programs – representing the packaging organization and translating customer requirements into internal technical direction.
Organize and lead cross‑functional task forces across silicon design, packaging, SI/PI, thermal‑mechanical, quality and reliability test, and supply chain to resolve issues, align decisions, and keep programs on schedule.
Proactively fill gaps between functional groups and track commitments to genuine closure.
Requirements
Bachelor's or Master's degree in Electrical, Materials, Mechanical, or Semiconductor Engineering
Mechanical Engineer responsible for design changes, product optimization, technical support, and documentation for sensing and monitoring technologies.
Responsibilities
Conduct design changes for product customization based on current product platform.
Optimize products through design changes.
Play the role of product expert to support production team to resolve technical problems.
Participate in the qualification of second source parts with an opportunity for supply continuity, cost reduction.
Comprehensive documentation responsibility that may include, but not limited to, generating and updating engineering drawings, Bill of Materials, product verification plans, and test reports.
Lead the design and development of enclosures, brackets, and mounting systems for ADAS sensors and ECUs, from concept through production, collaborating with cross‑functional teams.
Responsibilities
Design enclosures, covers, brackets and mounts for ADAS sensors and ECUs
Develop windshield camera brackets, radar mounting brackets and bumper/fascia integration features
Create 3D models and detailed 2D drawings with GD&T
Perform tolerance stack‑up analysis for sensor aim and component fit
Support FEA for structural, vibration, shock and drop analysis
Requirements
Bachelor's degree or higher in Electrical/Electronic Engineering, Mechanical Engineering, System Engineering, Computer Science or related field
Nice to have: Automotive safety regulation (Euro NCAP, ASEAN NCAP, IIHC, Global NCAP, Japan NCAP)
Nice to have: ISO 26262 functional safety
Nice to have: Thermal simulation (FloTHERM, Icepak)
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