Hardware Development Engineer II – Thermal Analysis
Compensation
USA, WA, Seattle - 136,000.00 - 184,000.00 USD annually
Responsibilities
Develop high-fidelity FEA and CFD thermal models of the drone's battery pack, motors, power electronics, and avionics, capturing conduction, convection, and radiation across the full flight envelope and ambient operating range.
Define and develop thermal management strategies and systems for the battery pack, including cold-weather heating, in-flight and ground cooling, and cell-to-cell temperature uniformity.
Develop cooling strategies for electric motors and motor controllers, including forced-air and conductive paths, and trade thermal performance against mass, drag, and packaging constraints.
Analyze candidate designs and quantify thermal margins, hot-spot locations, transient temperature response, and sensitivity to operating conditions, and communicate results as clear design recommendations.
Perform thermal analysis of avionics systems, defining heat-sinking, airflow, and conduction paths that maintain component junction temperatures within reliability limits.
Requirements
Bachelor's degree in mechanical engineering or equivalent
Nice to have: Master's degree in mechanical engineering or equivalent
Lead the design, development, qualification, and sustainment of mechanical systems, modules, and subsystems for Semiconductor Capital Equipment.
Responsibilities
Own the design, development, qualification, and sustainment of mechanical systems, modules, and subsystems for Semiconductor Capital Equipment throughout the product lifecycle.
Drive technical decisions, system architecture trade-offs, and innovative design solutions to meet performance, reliability, safety, cost, schedule, and DFX objectives.
Lead complex engineering problem-solving, root cause investigations, risk assessments, and implementation of corrective actions.
Develop and optimize Vacuum System Architectures including pump selection, pumping line design, conductance optimization, vacuum component integration, venting and purging solutions, and contamination control strategies.
Perform engineering analysis including Vacuum Performance, flow, thermal, structural, and reliability evaluations to ensure system-level performance targets are met.
Requirements
Bachelor's degree in Mechanical Engineering or related discipline
Nice to have: Master's degree in Mechanical Engineering or related discipline
Nice to have: semiconductor wafer fabrication equipment
As a Yield Enhancement Laboratory Engineer, you will be at the forefront of solving the most challenging yield and technology issues for Micron's advanced memory products. Working on leading-edge technologies, you will investigate complex electrical and physical failure mechanisms, transform analytical findings into actionable yield improvements, and contribute directly to technology development and manufacturing excellence.
Responsibilities
Investigate and solve complex yield, quality, and technology challenges through advanced electrical and physical failure analysis.
Perform fault isolation and failure characterization using industry-leading analytical techniques, including EMMI, OBIRCH, Thermal Analysis, SEM, FIB, TEM, nanoprobing, and related methodologies to identify failure mechanisms and drive rapid yield learning.
Apply knowledge of semiconductor device physics, circuit behavior, and manufacturing processes to establish root causes and enable effective process and design improvements.
Partner with Product Engineering, Design, Yield Enhancement, Process Engineering, and R&D teams to identify design marginalities, process interactions, and technology limitations impacting product performance.
Generate innovative solutions and develop new analytical methodologies to address emerging challenges in advanced memory technologies.
Requirements
Bachelor’s or advanced degree in Engineering or Science
Lead both thermal simulation and experimental validation of advanced cooling solutions for next-generation high-density server, networking, and data center platforms.
Responsibilities
Develop and execute thermal and CFD models for electronic systems, including servers, networking platforms, and liquid-cooled solutions
Perform thermal simulations to predict temperature, airflow, and pressure behavior
Model and analyze cooling technologies such as heat sinks, vapor chambers, heat pipes, fans, and liquid cooling systems
Conduct design trade-off studies and optimization to improve thermal performance, power density, and efficiency
Drive simulation-based design decisions during early architecture and design phases
Requirements
Bachelor's degree in Computer Science, Information Systems, Electronics, Electrical or equivalent
Master's degree in Computer Science, Information Systems, Electronics, Electrical or equivalent
Investigate and solve complex yield, quality, and technology challenges through advanced electrical and physical failure analysis.
Perform fault isolation and failure characterization using industry-leading analytical techniques, including EMMI, OBIRCH, Thermal Analysis, SEM, FIB, TEM, nanoprobing, and related methodologies to identify failure mechanisms and drive rapid yield learning.
Apply knowledge of semiconductor device physics, circuit behavior, and manufacturing processes to establish root causes and enable effective process and design improvements.
Partner with Product Engineering, Design, Yield Enhancement, Process Engineering, and R&D teams to identify design marginalities, process interactions, and technology limitations impacting product performance.
Generate innovative solutions and develop new analytical methodologies to address emerging challenges in advanced memory technologies.
Requirements
Bachelor’s or advanced degree in Engineering or Science
health insurance (medical, dental, vision, prescription, Basic Life & AD&D insurance and option for Supplemental life plans, EAP, Mental Health Support, Medical Advice Line, Flexible Spending Accounts, Adoption and Surrogacy Reimbursement coverage)
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