Electromagnetic Compatibility Engineer who seeks to enter the growing EV marketplace, focusing on providing EMC technical expertise for current and next gen vehicle platforms.
Compensation
The salary range for this role is $154,000 - $192,000 for Irvine, CA based applicants. The successful candidate may be eligible for annual performance bonus and equity awards.
Responsibilities
Work with hardware designers & EMC team to develop the next generation of control electronics for Rivian vehicles.
Develop and validate electromagnetic models to predict circuit behavior when integrated into vehicles and deployed in real-world environments.
Test ECU and vehicle design margins in our EMC laboratories.
Develop systems engineering models for EMI Source/Victim interactions at all levels of vehicle electronics that directly feed into electrical and mechanical integration and wiring harness design.
Lead EMC integration of high efficiency power conversion across multiple product types, including traction inverters, auxiliary inverters, onboard chargers, and DC-DC converters.
Requirements
Bachelor’s degree in electrical/computer engineering or similar discipline
Master’s degree in electrical engineering or similar discipline
PhD degree in electrical engineering or similar discipline
Own the design and verification of electrical subsystems that are a critical part of advanced military electronics and computing products, focusing on Electromagnetic Compatibility.
Responsibilities
Provide Electromagnetic Compatibility subject matter expertise including per MIL-STD-461/MIL-STD-464 and RTCA DO-160
Lead the cross-functional team in implementation of industry-standard EMC best practices
Provide design review across all programs
Establish company best practices for EMC design, analysis techniques, and sharing of lessons learned across product lines
Lead identification of risk related to EMC and execution of risk mitigation plans
Requirements
Bachelor’s or master’s degree in electrical engineering or related technical field
Design, review, and optimize complex printed circuit boards for high-performance electronics, collaborating with firmware, mechanical, and system teams to meet performance and cost targets.
Compensation
Rs 3000000 - Rs 12000000 (ie INR 3-12 LPA)
Responsibilities
Develop and iterate PCB layouts using Altium Designer for both low‑ and high‑speed applications.
Perform signal integrity analysis, impedance control, and power integrity optimization on high‑speed interfaces.
Collaborate with component vendors to evaluate libraries, footprints, and performance data for selected parts.
Create and maintain Design Rules, Manufacturing Data, and Board Support Packages (BSP) for efficient production.
Evaluate prototypes, analyze test data, and implement design corrections to achieve performance goals.
Requirements
Bachelor’s or Master’s degree in Electrical Engineering, Electronics, or a related field
Principal or Senior Principal Advanced Packaging Engineer to help shape the Co-Packaged Optics revolution in High-Performance Computing.
Compensation
Salary Range: $224,000 - $261,000
Responsibilities
Design and develop the package architecture from silicon validation to high-volume product adoption
Maintain technical documentation for delivery to vendors, manufacturing partners and customers
Provide mentorship to engineering staff throughout project execution
Collaborate with engineering and program management to make accurate risk assessments, driving critical project schedules
Coordinate with internal and external stakeholders including Reliability, Silicon Engineering, Validation, Design Service Vendors, substrate suppliers, and OSAT/assembly partners
Requirements
Advanced degree in Electrical Engineering or related field
Nice to have: high-power advanced package designs (>1kW)
Nice to have: optical transceiver design and validation
Nice to have: co-packaged optics
Nice to have: agentic design and verification workflows
Lead SI and PI design across assigned hardware projects, including lidar, camera, compute modules, and custom silicons, delivering end-to-end results from pre-layout feasibility study to post-fab correlations.
Compensation
$196,000—$242,000 USD
Responsibilities
Lead SI and PI design across assigned hardware projects, including lidar, camera, compute modules, and custom silicons
Deliver end-to-end results from pre-layout feasibility study, post-layout simulation to post-fab correlations
Define SI and PI acceptance criteria and partner with bench validation teams to root-cause and resolve SI and PI related issues
Review and direct vendor design and simulation workflows where applicable
Identify design risks and drive cross-functional solutions in collaboration with EE, PCB layout, Firmware and Mechanical teams
Implement advanced ASIC package architecture, with a strong focus on flip-chip BGA (FC-BGA) and multi-chip module (MCM) solutions, supporting the end-to-end package strategy for high-performance mixed-signal and digital SoCs.
Compensation
Base salary range for this role is $180,000 – $260,000 + equity in the company
Responsibilities
Define ASIC package architecture for FC-BGA and MCM solutions, including substrate stack-up, ball-map strategy, power delivery, signal breakout, and mechanical constraints.
Lead package-level trade studies across cost, performance, power integrity (PI), signal integrity (SI), thermal, manufacturability, and reliability.
Establish package design standards, methodologies, and best practices.
Drive detailed design of FC-BGA packages for high-pin-count ASICs with high-speed SerDes, dense power grids, and RF signal content.
Define and review substrate stack-ups, via strategies, impedance control, escape routing, and reference plane planning.
Lead advanced ASIC package architecture and execution, with a strong focus on flip-chip BGA (FC-BGA) and multi-chip module (MCM) solutions, owning the end-to-end package strategy for high-performance mixed-signal and digital SoCs.
Compensation
Base salary range for this role is $200,000 – $280,000 + equity in the company
Responsibilities
Own ASIC package architecture for FC-BGA and MCM solutions, including substrate stack-up, ball-map strategy, power delivery, signal breakout, and mechanical constraints.
Lead package-level trade studies across cost, performance, power integrity (PI), signal integrity (SI), thermal, manufacturability, and reliability.
Define long-term packaging roadmap aligned with future ASIC nodes, bandwidth scaling, and multi-die integration.
Establish organizational package design standards, methodologies, and best practices.
Drive detailed design of FC-BGA packages for high-pin-count ASICs with high-speed SerDes, dense power grids, and RF signal content.
High-speed IC package development engineer responsible for package development, electrical design, modeling, and characterization, including signal and power integrity aspects.
Compensation
Expected Base Pay Range (USD) 142,700 - 211,230, $ per annum
Responsibilities
Develop advanced microelectronic packages for semiconductors supporting 448 Gb/s data rates and beyond
Design electrical layouts and model package behavior
Characterize packages using EM simulation tools
Select package technology and drive layout with suppliers
Ensure manufacturability and compliance with performance, reliability, and cost requirements
Requirements
Bachelor’s degree in Computer Science, Electrical Engineering or related fields
Master’s/PhD in Computer Science, Electrical Engineering or related fields
Own hardware development from requirements and architecture through schematic capture, PCB layout, validation, and production release.
Select components, define footprints, and manage bills of materials with attention to performance, availability, cost, and lifecycle.
Design analog and digital circuits, power supplies, sensor interfaces, communication interfaces (I²C, SPI, UART, USB, Ethernet, etc.), and microcontroller/processor subsystems.
Perform circuit simulation and engineering analysis to evaluate power, signal integrity, timing, and thermal performance.
Bring up and debug prototypes using oscilloscopes, logic analyzers, power supplies, electronic loads, and other lab equipment.
Requirements
Bachelor’s degree in Electrical Engineering
Nice to have: Master’s degree in Electrical Engineering
Staff EMC Engineer, High VoltageNewRivian Automotive · Irvine, US
Staff Electrical Engineer- EMCNewITI Engineering · Winter Springs, US
Principal Engineer, Advanced PackagingNewAyar Labs · San Jose, US
Senior Signal Integrity and Power Integrity EngineerNewWaymo · Mountain View, US
Senior ASIC Package Design EngineerK2 Space · Remote, US
Hardware EngineerRoot Access · New York City